Applications for Syracuse University’s study abroad programs for the spring 2026 semester open on May 15. Students can choose from over 60 destinations worldwide, providing diverse experiences in various cultural and academic settings.
For the second consecutive year, Syracuse Abroad has been ranked No. 8 in Study Abroad by U.S. News & World Report. This ranking reflects the program’s dedication to global engagement and immersive learning provided at centers in Florence, London, Madrid, Santiago, and Strasbourg.
Among the offerings, the London Center introduces a new engineering program in spring 2026. It targets second-year students in aerospace, biomedical, chemical, civil, computer, electrical, environmental, and mechanical engineering, covering critical academic requirements while exposing students to the U.K.’s economic landscape.
In Santiago, the English immersion program includes courses in social sciences and humanities at U. Catolica, a top Latin American university. This program runs from January to May, featuring travel opportunities to Buenos Aires and Patagonia.
The Whitman Core program in London invites second-year students from the Whitman School of Management to complete core business courses, allowing them to engage with London’s business environment. For those interested in French, students can study language and culture at Strasbourg’s partner universities, including the University of Strasbourg.
Syracuse’s World Partner Programs offer over 50 options globally, ranging from public health in India to Arabic studies in Morocco, catering to students who seek unique overseas experiences.
The application period for spring 2026 runs from May 15 to October 1, with rolling reviews, though some programs may have specific deadlines. Students are advised to apply early due to limited spaces. If a first-choice program reaches capacity, students must select alternative options.
Further information and guidance are available through international program advisors, with virtual advising available in the summer.
